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Forced air convection reflow oven MR260

The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. All heating parameters and registered profiles can be easily observed on built-in 17" LCD display. 

By eliminating set-up time your production line can work to its fullest capacity.


  • Forced air convection heat to maximum temperatures up to 280°C.
  • Forced air convection provides uniform heating and prevents shadowing.
  • Three heating zones, one cooling zone; each independently controlled for accurate temperature profiles.
  • Digital PID regulators ensuring high stability of each zone temperature.
  • Output to external storage device for print-out program data and temperature profiles.
  • 4-channel PCB temperature registration

Technical specs

  • Power requirements: 208/240VAC 1-phase
  • Rated power max.: 3800 Watts
  • 17" LCD
  • Dynamic warming-up control ensuring stable temperaturesand virtually no overshoot.
  • USB port for external storage.
  • Profiling software for temperature data recording.
  • Graphic display mode for viewing temperature on a time base.
  • 3 heating zones, one cooling zone.
  • Stainless steel mesh conveyor belt
  • Conveyor speed: 10 - 80 cm/min (4 -- 31.5 inch/min)
  • Up to 280° C for lead free soldering.
  • Clearance for assemblies up to 25mm (1 inch)
  • Soldering width: 260 mm (10 inch)
  • Length process chamber: 900 mm (35 inch)
  • Heat-up time: approx. 15 min.
  • Dimensions: 1650 x 500 x 360 mm (L x W x H)
  • Net weight: 80 kg


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