Mechatronika launched new conveyor reflow oven MR 260.

The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. The conveyor, mesh system, three heating zones, one cooling zone; each independently controlled for accurate temperature profiles All heating parameters and registered profiles can be easily observed on built-in 17" LCD display.